[2] An array of electronic chips is mounted within a sealed rectangular enclosure, and cooling is implemented by attaching an aluminum heat sink (k = 180 W/m .. K). The base of the heat sink has dimensions of w1 = W2 = 100 mm, while the 6 fins are of thickness t = 10 mm and pitch S = 18 mm. The fin length is Lr = 50 mm, and the base of the heat sink has a thickness of Lb = 10 mm. Chips Water u, T Electronic- package, Pelec If cooling is implemented by water flow through the heat sink, with uo = 3 m/s and T0 = 17°C, what is the base temperature Tb of the heat sink when power dissipation by the chips is Pelec = 1800 W? The average convection coefficient for surfaces of the fins and the exposed base may be estimated by assuming parallel flow over a flat plate. Properties of the water may be approximated as k = 0.62 W/m-K, p 995 kg/m3, Cp = 4178 J/kg-K, v = 7.73 x 10-7 m2/s, and Pr = 5.2. a.) Base temperature. A. 37.8°C С. 31.4°С D. 46.2°C B. 43.9°C
[2] An array of electronic chips is mounted within a sealed rectangular enclosure, and cooling is implemented by attaching an aluminum heat sink (k = 180 W/m .. K). The base of the heat sink has dimensions of w1 = W2 = 100 mm, while the 6 fins are of thickness t = 10 mm and pitch S = 18 mm. The fin length is Lr = 50 mm, and the base of the heat sink has a thickness of Lb = 10 mm. Chips Water u, T Electronic- package, Pelec If cooling is implemented by water flow through the heat sink, with uo = 3 m/s and T0 = 17°C, what is the base temperature Tb of the heat sink when power dissipation by the chips is Pelec = 1800 W? The average convection coefficient for surfaces of the fins and the exposed base may be estimated by assuming parallel flow over a flat plate. Properties of the water may be approximated as k = 0.62 W/m-K, p 995 kg/m3, Cp = 4178 J/kg-K, v = 7.73 x 10-7 m2/s, and Pr = 5.2. a.) Base temperature. A. 37.8°C С. 31.4°С D. 46.2°C B. 43.9°C
Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)
8th Edition
ISBN:9781305387102
Author:Kreith, Frank; Manglik, Raj M.
Publisher:Kreith, Frank; Manglik, Raj M.
Chapter4: Numerical Analysis Of Heat Conduction
Section: Chapter Questions
Problem 4.15P
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