Principles of Instrumental Analysis
7th Edition
ISBN:9781305577213
Author:Douglas A. Skoog, F. James Holler, Stanley R. Crouch
Publisher:Douglas A. Skoog, F. James Holler, Stanley R. Crouch
Chapter21: Surface Characterization By Spectroscopy And Microscopy
Section: Chapter Questions
Problem 21.10QAP
Related questions
Question
An article in Solid State Technology, "Orthogonal Design of Process Optimization and Its Application to Plasma Etching" by G.Z. Yin and D.W. Jillie (May, 1987) describes an experiment to determine the effect of C2F6 flow rate on the uniformity of the etch on a silicon wafer used in integrated circuit manufacturing. Data for two flow rates are as follows:
C2F6 |
Uniformity Observation |
|||||
(SCCM) |
1 |
2 |
3 |
4 |
5 |
6 |
125 |
2.7 |
4.6 |
2.6 |
3.0 |
3.2 |
3.8 |
200 |
4.6 |
3.4 |
2.9 |
3.5 |
4.1 |
5.1 |
C2F6 |
Uniformity Observation |
|||||
(SCCM) |
1 |
2 |
3 |
4 |
5 |
6 |
125 |
2.7 |
4.6 |
2.6 |
3.0 |
3.2 |
3.8 |
200 |
4.6 |
3.4 |
2.9 |
3.5 |
4.1 |
5.1 |
(a) Does the C2F6 flow rate affect average etch uniformity? Use = 0.05.
(b) What is the P-value for the test in part (a)?
Expert Solution
This question has been solved!
Explore an expertly crafted, step-by-step solution for a thorough understanding of key concepts.
This is a popular solution!
Trending now
This is a popular solution!
Step by step
Solved in 3 steps with 3 images
Knowledge Booster
Learn more about
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, chemistry and related others by exploring similar questions and additional content below.Recommended textbooks for you
Principles of Instrumental Analysis
Chemistry
ISBN:
9781305577213
Author:
Douglas A. Skoog, F. James Holler, Stanley R. Crouch
Publisher:
Cengage Learning
Principles of Instrumental Analysis
Chemistry
ISBN:
9781305577213
Author:
Douglas A. Skoog, F. James Holler, Stanley R. Crouch
Publisher:
Cengage Learning